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  d i r e c t p w m v a r i a b l e s p e e d f a n m o t o r d r i v e r c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 5 - s e p . , 2 0 0 9 a p x 9 2 6 2 / 3 w w w . a n p e c . c o m . t w 1 a n p e c r e s e r v e s t h e r i g h t t o m a k e c h a n g e s t o i m p r o v e r e l i a b i l i t y o r m a n u f a c t u r a b i l i t y w i t h o u t n o t i c e , a n d a d v i s e c u s t o m e r s t o o b t a i n t h e l a t e s t v e r s i o n o f r e l e v a n t i n f o r m a t i o n t o v e r i f y b e f o r e p l a c i n g o r d e r s . f e a t u r e s g e n e r a l d e s c r i p t i o n the APX9262/3 is a hig h efficient direct pwm drive ic with single phase and cmos drive. such ic design is suit able for variable speed control fan of personal computer?s power supply radiation and cpu cooler. the device is built-in lock protection. when fan is locked, the device will enter the lockup pr otection mode. it is also with rotation detection output and thermal shut- down function. in normal operation, supp ly current is 6ma. the APX9262/3 is avail able in ssop-16 package. single phase full wave fan driver low supply current built-in variable speed function include hall bias circuit built-in lock protection and auto restart func- tion fg output and rd output signal available built-in current limit circuit built-in thermal protection circuit ssop-16 package l e a d f r e e a n d g r e e n d e v i c e s a v a i l a b l e ( r o h s c o m p l i a n t ) a p p l i c a t i o n s c p u c o o l e r v a r i a b l e s p e e d c o n t r o l f a n p i n c o n f i g u r a t i o n a p x 9 2 6 2 a p x 9 2 6 3 rd 8 fg 7 set 5 out2 2 15 out1 vcc 3 osc 6 min 4 14 sgnd 10 hb 13 ct 16 pgnd 9 in+ 12 nc 11 in- pgnd 1 ssop-16 rd 8 fg 7 set 5 nc 2 15 out1 vcc 3 osc 6 min 4 14 sgnd 10 hb 13 ct 16 pgnd 9 in+ 12 nc 11 in- out2 1 ssop-16
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 5 - s e p . , 2 0 0 9 a p x 9 2 6 2 / 3 w w w . a n p e c . c o m . t w 2 a b s o l u t e m a x i m u m r a t i n g s ( n o t e 1 ) symbol parameter ratings unit v cc vcc pin supply vo ltage - 3 to 1 8 v i out out1/out2 pin output c urrent 0 to 1 a v out 1 /v out2 out1/out2 pin output v oltage - 3 to 1 8 v i hb hb pin output current 0 to 10 m a v set / v min set/min pin input voltage - 0.3 to 6 v v rd / v fg rd/fg o utput v oltage - 0.3 to 1 8 v i rd / i fg rd/fg sink c urrent 0 to 10 m a r th,ja thermal resistance - junction to ambient ssop - 16 156 x c / w p d power dissipation (note2) 0.8 w t j junction temperature - 40 to 150 c t stg storage t emperature - 55 to 150 c t sdr maximum lead soldering temperature, 10 seconds 260 c note 1: stresses above those listed in ?absolute maximum ratings? may cause permanent damage to the device. note 2: mounted on a board (60x38x1.6t mm, glass epoxy). r e c o m m e n d e d o p e r a t i n g c o n d i t i o n s symbol parameter rating unit v cc vcc pin supply v oltage 4.5 to 15 v v set set pin input v oltage r ange 0 to 6 v v min min pin input voltage range 0 to 6 v v icm common - m ode h all i nput v oltage r ange 0.2 to 3 v t a ambient temperature - 40 to 90 c o r d e r i n g a n d m a r k i n g i n f o r m a t i o n APX9262 package code n : ssop-16 operating ambient temperature range i : -40 to 90 o c handling code tr : tape & reel assembly material g : halogen and lead free device handling code temperature range package code APX9262 n : APX9262 xxxxx xxxxx - date code assembly material apx9263 apx9263 n : apx9263 xxxxx xxxxx - date code n o t e : a n p e c l e a d - f r e e p r o d u c t s c o n t a i n m o l d i n g c o m p o u n d s / d i e a t t a c h m a t e r i a l s a n d 1 0 0 % m a t t e t i n p l a t e t e r m i n a t i o n f i n i s h ; w h i c h a r e f u l l y c o m p l i a n t w i t h r o h s . a n p e c l e a d - f r e e p r o d u c t s m e e t o r e x c e e d t h e l e a d - f r e e r e q u i r e m e n t s o f i p c / j e d e c j - s t d - 0 2 0 d f o r m s l c l a s s i f i c a t i o n a t l e a d - f r e e p e a k r e f l o w t e m p e r a t u r e . a n p e c d e f i n e s ? g r e e n ? t o m e a n l e a d - f r e e ( r o h s c o m p l i a n t ) a n d h a l o g e n f r e e ( b r o r c l d o e s n o t e x c e e d 9 0 0 p p m b y w e i g h t i n h o m o g e n e o u s m a t e r i a l a n d t o t a l o f b r a n d c l d o e s n o t e x c e e d 1 5 0 0 p p m b y w e i g h t ) .
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 5 - s e p . , 2 0 0 9 a p x 9 2 6 2 / 3 w w w . a n p e c . c o m . t w 3 APX9262/3 symbol parameter test conditions min . typ . max . unit supply current v hb hb pin output voltage i hb = 5ma 1.15 1.3 1.45 v i cc1 rotation m ode - 6 10 ma i cc2 operating c urrent lock p rotect ion m ode - 6 10 m a oscillator v osch osc h igh l ev el v oltage c osc = 100pf 3. 45 3. 6 3.75 v v oscl osc l ow l evel v oltage c osc = 100pf 1. 95 2.05 2.15 v f osc osc o scillation f requency c osc = 100pf 18 25 32 k hz lock protection v ct h ct p in h igh l evel v oltage c ct = 1 m f 3.24 3.6 3.96 v v ctl ct p in l ow l evel v oltage c ct = 1 m f 1.2 1.4 1.6 v i ct1 ct c harge c urrent v ct = 0v 1.5 2 2.5 m a i ct2 ct d ischarge c urrent v ct = 3.6 v 0.15 0.2 0.25 m a r ct ct c harge/ d ischarge c urrent r atio r ct = i ct1 /i ct2 8.5 10 11.5 - output drivers v ol output l ower s ide s aturation i o ut = 200 ma - 0. 1 0. 2 v v oh output u pper s ide s aturation i o ut = 2 00ma - 0. 25 0.5 v v rd / v fg rd/fg p in l ow v oltage i fg = 5ma - 0. 2 0. 3 v i rdl / i fgl rd/fg p in l eak c urrent v fg = 7v - - 0.1 m a hall sensitivity v hn hall i nput s ensitivity zero to peak including offset and hysteresis - 10 2 5 mv thermal shutdown over - temperature shutdown threshold - 1 60 - over - temperature shutdown hysteresis - 2 0 - c current limit i lim current limit value 0.85 1 1.15 a e l e c t r i c a l c h a r a c t e r i s t i c s (v cc = 12v, t a = 2 5 c , u n l e s s o t h e r w i s e s p e c i f i e d )
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 5 - s e p . , 2 0 0 9 a p x 9 2 6 2 / 3 w w w . a n p e c . c o m . t w 4 0 0.5 1 1.5 2 2.5 0 2 4 6 8 10 12 14 16 0 2 4 6 8 10 0 0.05 0.1 0.15 0.2 0.25 0.3 0.35 0.4 0.45 t y p i c a l o p e r a t i n g c h a r a c t e r i s t i c s vcc supply current (ma) v c c s u p p l y v o l t a g e ( v ) v c c s u p p l y c u r r e n t v s . v c c s u p p l y v o l t a g e vcc supply current (ma) v c c s u p p l y v o l t a g e ( v ) v c c s u p p l y c u r r e n t v s . v c c s u p p l y v o l t a g e ct charge/discharge current ( m a) v c c s u p p l y v o l t a g e ( v ) c t c h a r g e / d i s c h a r g e c u r r e n t v s . v c c s u p p l y v o l t a g e output saturation voltage (v) o u t p u t c u r r e n t ( m a ) o u t p u t s a t u r a t i o n v o l t a g e v s . o u t p u t c u r r e n t osc frequency (khz) v c c s u p p l y v o l t a g e ( v ) o s c f r e q u e n c y v s . v c c s u p p l y v o l t a g e rd/fg pin low voltage (v) r d / f g p i n s i n k c u r r e n t ( m a ) r d / f g p i n l o w v o l t a g e v s . s i n k c u r r e n t 0 1 2 3 4 5 6 7 0 2 4 6 8 10 12 14 16 0 1 2 3 4 5 6 7 0 2 4 6 8 10 12 14 16 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 0 200 400 600 800 1000 rotation mode lock protection mode charge current discharge current upper side saturation voltage lower side saturation voltage 0 5 10 15 20 25 30 35 40 45 0 2 4 6 8 10 12 14 16 c osc =100pf
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 5 - s e p . , 2 0 0 9 a p x 9 2 6 2 / 3 w w w . a n p e c . c o m . t w 5 t y p i c a l o p e r a t i n g c h a r a c t e r i s t i c s ( c o n t . ) osc high/low level voltage (v) v c c s u p p l y v o l t a g e ( v ) o s c h i g h / l o w l e v e l v o l t a g e v s . v c c s u p p l y v o l t a g e maximum power dissipation (w) m a x i m u m p o w e r d i s s i p a t i o n v s . a m b i e n t t e m p e r a t u r e a m b i e n t t e m p e r a t u r e ( c ) 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 0 25 50 75 100 125 150 90 0 2 4 6 8 10 12 14 16 0 1 2 3 4 5 6 c osc =100pf osc high level osc low level
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 5 - s e p . , 2 0 0 9 a p x 9 2 6 2 / 3 w w w . a n p e c . c o m . t w 6 l o c k p r o t e c t i o n w a v e f o r m 2 t i m e ( 1 s / d i v ) o p e r a t i n g w a v e f o r m s v out1 (10v/div) v out2 (10v/div) v ct (2v/div) v rd (10v/div) r o t a t i o n w a v e f o r m 1 r o t a t i o n w a v e f o r m 2 t i m e ( 1 m s / d i v ) t i m e ( 2 0 u s / d i v ) v in+ (100mv/div) v in- (100mv/div) v out2 (5v/div) v out1 (5v/div) v min (1v/div) v osc (1v/div) v set (1v/div) v out1 (5v/div) t i m e ( 0 . 2 m s / d i v ) r o t a t i o n w a v e f o r m 3 t i m e ( 1 s / d i v ) l o c k p r o t e c t i o n w a v e f o r m 1 v out1 (10v/div) v out2 (10v/div) v osc (1v/div) i out (100ma/div) v out1 (10v/div) v out2 (10v/div) v ct (2v/div) v rd (10v/div)
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 5 - s e p . , 2 0 0 9 a p x 9 2 6 2 / 3 w w w . a n p e c . c o m . t w 7 pin no. name func tion pgnd (APX9262) power stage gnd. 1 out2 (apx9263) h - bridge o utput c onnection. out2 (APX9262) h - bridge o utput c onnection. 2 nc (apx9263) no connection. 3 vcc supply voltage input pin. 4 min speed setting. an external voltage into min pin to set fan speed. 5 set speed setting. an external voltage into set pin to set fan speed. 6 osc oscillation frequency setting. connect a capacitor to gnd to set oscillation frequency. 7 fg rotation speed output. this is an open ? collector ou tput. 8 rd rotation detection output. this is an open ? collector output. 9 in+ hall input +. connect to hall element positive output. 10 hb hall bias. this is a 1.3v constant ? voltage output for hall element bias. 1 1 in - hall input - . connect to hall ele ment negative output. 1 2 nc no connection. 1 3 ct shutdown time and restart time setting. connect a capacitor to gnd to set shutdown time and restart time in lock mode. 1 4 sgnd control stage gnd. 1 5 out1 h - bridge o utput c onnection. 16 pgnd power stage gnd. b l o c k d i a g r a m p i n d e s c r i p t i o n s controller hall bias thermal shutdown discharge circuit level shift level shift oscillation circuit hall m set min sgnd pgnd vcc hb in+ in- ct osc fg rd out1 out2 0.47 to 1 f m
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 5 - s e p . , 2 0 0 9 a p x 9 2 6 2 / 3 w w w . a n p e c . c o m . t w 8 t y p i c a l a p p l i c a t i o n c i r c u i t hb in- in+ min set osc ct sgnd pgnd out1 out2 rd fg vcc h pwm input c osc =100pf c ct =0.47 to 1 m f c1=4.7 m f r1=2 w v in m r fg =10k w r rd =10k w d1 pull high voltage note 3: in hot plug application, it?s necessary to protect against a hot plug input voltage overshoot. placing a 2 w resistor (r1) in series with a 4.7 m f capacitor (c1) dampens the overshoot.
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 5 - s e p . , 2 0 0 9 a p x 9 2 6 2 / 3 w w w . a n p e c . c o m . t w 9 t r u t h t a b l e input output in - in+ osc ct out1 out2 fg rd mode h l h l l l l h h l h off l r otation (d rive ) pwm o n h l off l l l l h l l l off off l r otation (r e - circulation ) pwm off h l l l l l h - h l l off off lock mode note 4: osc-h corresponds to osc>set and osc-l corresponds to osc c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 5 - s e p . , 2 0 0 9 a p x 9 2 6 2 / 3 w w w . a n p e c . c o m . t w 1 0 a p p l i c a t i o n i n f o r m a t i o n ( c o n t . ) refer to ?maximum power dissipation vs. ambient temperature ?, the ic is safe to operate below the curve, and it will cause the thermal protection if the operating area is abo ve the line. for example, t a = 5 0 o c , t h e s s o p - 1 6 p a c k a g e m a x i m u m p o w e r d i s s i p a t i o n i s a b o u t 0 . 8 w . power dissipation can be calculated by the following equation: for example: when v cc = 12v, i cc = 4ma, i out = 300ma, v out1 = 11.7v, v oout2 = 0.22v, the p d = 0.204w according to the power dissipation issue, we could adapt this ssop-16 package. the gnd pin provides an electrical connection to ground and channeling heat away. the printed circuit board (pcb) forms a heat sink and dissipates most of the heat into ambient air. thermal consideration ( ) cc cc out out2 out1 cc d i v + i | v v | - v = p +
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 5 - s e p . , 2 0 0 9 a p x 9 2 6 2 / 3 w w w . a n p e c . c o m . t w 1 1 p a c k a g e i n f o r m a t i o n s s o p - 1 6 0 l view a 0 . 2 5 gauge plane seating plane a a 1 e 1 e h x 4 5 c see view a d b e a 2 s y m b o l min. max. 1.75 1.24 0.15 0.25 a a2 c d e e l h millimeters b 0.20 0.30 ssop-16 0.25 0.50 0.40 1.27 min. max. inches 0.069 0.049 0.008 0.012 0.006 0.010 0.010 0.020 0.016 0.050 0 0.10 a1 0.25 0.004 0.010 e1 0 0 8 8 4.80 5.80 3.80 0.635 bsc 5.00 6.20 4.00 0.189 0.228 0.150 0.025 bsc 0.197 0.244 0.157 note : 1. follow jedec mo-137 ab. 2. dimension "d" does not include mold flash, protrusions or gate burrs. mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. dimension "e" does not include inter-lead flash or protrusions. inter-lead flash and protrusions shall not exceed 10 mil per side.
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 5 - s e p . , 2 0 0 9 a p x 9 2 6 2 / 3 w w w . a n p e c . c o m . t w 1 2 d e v i c e s p e r u n i t c a r r i e r t a p e & r e e l d i m e n s i o n s package type unit quantity ssop - 16 tape & reel 2500 application a h t1 c d d w e1 f 330.0 ? 2.00 50 min. 12.4+2.00 - 0.00 13.0+0.50 - 0.20 1.5 min. 20.2 min. 12.0 ? 0.30 1.75 ? 0.10 5.50 ? 0.10 p 0 p1 p 2 d 0 d1 t a 0 b 0 k 0 s sop - 16 4.00 ? 0.10 8.00 ? 0.10 2.00 ? 0.05 1.5+0.10 - 0.00 1.5 min. 0.6+0.00 - 0.40 6.40 ? 0.20 5.20 ? 0.20 2.10 ? 0.20 (mm) h t1 a d a e 1 a b w f t p0 od0 b a0 p2 k0 b 0 section b-b section a-a od1 p1
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 5 - s e p . , 2 0 0 9 a p x 9 2 6 2 / 3 w w w . a n p e c . c o m . t w 1 3 c l a s s i f i c a t i o n p r o f i l e t a p i n g d i r e c t i o n i n f o r m a t i o n s s o p - 1 6 user direction of feed
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 5 - s e p . , 2 0 0 9 a p x 9 2 6 2 / 3 w w w . a n p e c . c o m . t w 1 4 profile feature sn - pb eutectic assembly pb - free assembly preheat & soak temperature min (t smin ) temperature max (t smax ) time (t smin to t smax ) ( t s ) 100 c 150 c 60 - 120 seconds 150 c 200 c 60 - 1 2 0 seconds average ramp - up rate (t smax to t p ) 3 c/second ma x. 3 c/second max. liquidous temperature ( t l ) time at l iquidous (t l ) 183 c 60 - 150 seconds 217 c 60 - 150 seconds peak package body temperature (t p ) * see classification temp in table 1 see classification temp in table 2 time (t p ) ** within 5 c of the spec ified c lassification t emperature ( t c ) 2 0 ** seconds 3 0 ** seconds average r amp - down rate (t p to t smax ) 6 c/second max. 6 c/second max. time 25 c to p eak t emperature 6 minutes max. 8 minutes max. * tolerance for peak profile temperature (t p ) is defined a s a supplier minimum and a user maximum. ** tolerance for time at peak profile temperature (t p ) is defined as a supplier minimum and a user maximum. table 2. pb - free process ? classification temperatures (tc) package thickness volume mm 3 <350 volume mm 3 350 - 2000 volume mm 3 >2000 <1.6 mm 260 c 260 c 260 c 1.6 mm ? 2.5 mm 260 c 250 c 245 c 3 2.5 mm 250 c 245 c 245 c table 1. snpb eutectic process ? classification temperatures (tc) package thickness volume mm 3 <350 volume mm 3 3 350 <2.5 mm 235 c 22 0 c 3 2.5 mm 220 c 220 c test item method description solderability jesd - 22, b102 5 sec, 245 c holt jesd - 22, a108 1000 hrs, bias @ 125 c pct jesd - 22, a102 168 hrs, 100 % rh, 2atm , 121 c tct jesd - 22, a104 500 cycles, - 65 c~150 c hbm mil - std - 883 - 3015.7 vhbm ? 2kv mm jesd - 22, a115 vmm ? 200v latch - up jesd 78 10ms, 1 tr ? 100ma r e l i a b i l i t y t e s t p r o g r a m c l a s s i f i c a t i o n r e f l o w p r o f i l e s
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 5 - s e p . , 2 0 0 9 a p x 9 2 6 2 / 3 w w w . a n p e c . c o m . t w 1 5 c u s t o m e r s e r v i c e a n p e c e l e c t r o n i c s c o r p . head office : no.6, dusing 1st road, sbip, hsin-chu, taiwan tel : 886-3-5642000 fax : 886-3-5642050 t a i p e i b r a n c h : 2 f , n o . 1 1 , l a n e 2 1 8 , s e c 2 j h o n g s i n g r d . , s i n d i a n c i t y , t a i p e i c o u n t y 2 3 1 4 6 , t a i w a n t e l : 8 8 6 - 2 - 2 9 1 0 - 3 8 3 8 f a x : 8 8 6 - 2 - 2 9 1 7 - 3 8 3 8


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